Delhi High Court Restores Interim Injunction In Favour Of Mold-Tek Packaging; Remands Patent Validity Issue For Fresh Consideration

The Division Bench of the Delhi High Court comprising Justice C. Hari Shankar and Justice Om Prakash Shukla has partly set aside an order of the Commercial Court and restored the ex parte ad interim injunction in favour of Mold-Tek Packaging Ltd. in a patent infringement dispute against Neway Industries Pvt. Ltd.The Court clarified that once a...